Our laser glass cutting machines are equipped with a self-developed glass cutting head, ensuring a fine
and deep focus light spot. The lens used in the cutting head is imported, further enhancing the precision of the machine.
Technical Parameter
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Laser type |
Infrared Picosecond |
Cutting Speed |
0-500mm/s |
Working Environment |
26℃ |
Cutting Accuracy |
±0.01mm |
Transmission System |
Rack And Pinion |
Cutting Area |
|
Input Voltage |
<5KW,AC220V |
Graphic Format Supported |
PLT, DXF, Dwg, DXP |
Cabinet Weight |
3500KG |
Cabinet Dimension |
2150mmX2080mmX1960mm |
Widely used in instruments, thick, extra thick glass industry cutting, such as: ultra white glass, white glass, high borosilicate glass, quartz glass, etc.;
Reinforced and non-reinforced glass cutting, such as: mobile phone glass cover plate, car glass cover plate, camera glass cover plate, etc.;
Sapphire glass cutting, such as: mobile sapphire cover plate, camera sapphire glass cover plate, sapphire light strip (LED light strip), etc.
1. Picosecond processing uses small single pulse energy, high frequency processing, fine carving, processing surface is more fine and smooth. There are three power options: 30W, 50W and 70W.
2. 600*500mm working width issuitable for most cutting scenes.
This machine can be used for 0.1mm-6mm reinforced and non reinforced glass cutting, such as mobile phone glass cover, car glass cover and camera glass cover. 0.1mm-2mm sapphire glass cutting, such as: mobile phone sapphire cover,camera sapphire glass cover, sapphire lamp post(LED lamp post).LCD glass cutting and other optical lens cutting.processing.