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ShenZhen CKD Precision Mechanical & Electrical Co., Ltd. 86-755-29532448 foreign-trade@ckdseiki.com
Thick Glass Laser Cutting Machine with RFC02 150W 10.6µm CO2 Source and Cutting Accuracy ±0.01mm

Thick Glass Laser Cutting Machine with RFC02 150W 10.6µm CO2 Source and Cutting Accuracy ±0.01mm

  • Highlight

    10.6µm Laser Glass Cutting Machine

    ,

    Thick Glass Laser Cutting Machine

    ,

    150W Laser Glass Cutting Machine

  • Customizable Options
    Custom Options Available For Table Size, Laser Power (up To 500W), And Special Cutting Heads (like For Curved Or Micro-level Cutting) To Meet Specific Needs.
  • Compatibility With Automation Systems
    Supports Integration With Major Automation Systems, Including Robot Interfaces And Automatic Loading/unloading Systems. Standard Industrial Communication Protocols (like Modbus, OPC) Are Supported.
  • Splitting Laser Source
    RFC02 (Radio Frequency CO2) - RFC02 10.6μm 150W (options: 250W/350W) - 150W(250W/350W) 1-100kHz Water Cooling
  • Mobility
    Equipped With Heavy-duty Wheels For Easy Movement And Repositioning, With Locking Mechanisms For Stability
  • Laser Wavelength
    1064nm
  • Cutting Accuracy
    ±0.01mm
  • Chipping
    ≤5μm
  • Working Frequency
    50HZ/60HZ
  • Place of Origin
    China
  • Brand Name
    CKD
  • Certification
    ISO CE
  • Model Number
    CKD-DP6070C-50E CKD-DP6070C-60E CKD-DP6070C-80TE CKD-DP6070C-50ECKD-DP6070S-50E CKD-DP6070S-60E CKD-DP6070S-80TE CKD-DP6070S-80ECKD-DP6070D-50E CKD-DP6070D-60E CKD-DP6070D-80TE CKD-DP6070D-80ECKD-SP6070S-50E CKD-SP6070S-60E CKD-SP6070S-80TE CKD-SP6070S-80E
  • Minimum Order Quantity
    1
  • Price
    Negotiated
  • Packaging Details
    Wooden vacuum packaging
  • Delivery Time
    25-45 days
  • Payment Terms
    L/C, T/T
  • Supply Ability
    60sets per month

Thick Glass Laser Cutting Machine with RFC02 150W 10.6µm CO2 Source and Cutting Accuracy ±0.01mm

Product Description:
Thick Glass Laser Cutting Machine with RFC02 150W 10.6µm CO2 Source and Cutting Accuracy ±0.01mm 0

Advanced Laser Cutting Machine: Precision and Versatility
Key Features:
  • High-Power Laser Source: Equipped with a cutting-edge, high-frequency pulsed laser for superior cutting performance.
  • Versatile Material Handling: Capable of processing a wide range of materials including metals and non-metals.
  • Multifunctional Cutting Capabilities:
    • Supports continuous sheet cutting
    • Precision single-point cutting
    • Efficient strip cutting
  • Advanced X/Y Axis Control: Utilizes high-precision DC servo motors and ultra-fine 0.1μm optical encoders for unparalleled accuracy.
  • Intelligent Motion Control: Features automatic focus-following functionality and dynamic piercing control.
  • High-Resolution Imaging: Incorporates a premium CCD camera system for real-time visual monitoring, pattern recognition, and mark point detection.
  • Robust Power Supply: Equipped with a German-made, high-stability power source. Taiwanese brand power supply used for optical components.
  • Impressive Cutting Range: Capable of processing materials up to 19mm in thickness, catering to a wide array of industrial applications.
  • Precision-Engineered Components:
    • Motor base and optical platform constructed with natural granite
    • Designed for superior stability and vibration resistance
    • Ensures maintained accuracy over time
Additional Benefits:
  • Ideal for high-precision industrial applications
  • User-friendly interface for easy operation
  • Reduced material waste due to precise cutting
  • Suitable for both small-scale and large-volume production runs
  • Low maintenance requirements, ensuring long-term reliability
 

Features:

Advanced Laser Cutting System: Features, Advantages, and Applications
Key Features
  1. Precision Cutting
    • Irregular shape high-speed cutting
    • Contour cutting
    • Small hole drilling
    • Hand-held cutting capabilities
  2. Superior Processing
    • High-quality edge finishing
    • No taper effects
    • Minimal material loss
    • Burr-free cutting
  3. Eco-Friendly Operation
    • No pollution
    • No powder residue
    • No wastewater production
Advantages
  1. High-Speed Processing
    • Rapid cutting of complex shapes and patterns
  2. Superior Cut Quality
    • Clean edges with no tapering
    • Minimal to no burrs
    • Extremely small chipping, if any
  3. Cost-Effective
    • High yield rate
    • Low consumable usage
    • Energy-efficient operation
  4. Environmentally Friendly
    • Clean process with no harmful byproducts
Compatible Materials
  1. Specialized Glass
    • Ultra-clear glass
    • Plain white glass
    • High borosilicate glass
    • Quartz glass
  2. Electronic Components
    • Phone glass covers
    • Car glass
    • Camera glass covers
    • LCD screens
  3. Optical Materials
    • K9 glass
    • Various optical filters
    • Mirror cutting
  4. Precious Materials
    • Sapphire processing for watch faces and electronic components
Applicable Industries
  1. Glass Manufacturing
    • Optical glass
    • Tempered glass
    • Ultra-thin glass
    • Laboratory glassware
    • Medical glass equipment
  2. Electronics
    • Mobile phone screens and covers
    • Tablet displays
    • Laptop screens
    • Optical/ITO/Yellow/Purple semiconductor glass
  3. Automotive
    • Car windows and windshields
    • Dashboard displays
    • Instrumentation panels
  4. Real Estate and Construction
    • Architectural glass
    • Decorative glass panels
    • Bathroom glass fixtures
  5. Home Appliances
    • Glass panels for ovens and refrigerators
    • Lighting glass components
  6. Communication Media
    • Mobile device screens
    • Watch sapphire covers
    • Camera and CCTV lenses
  7. New Energy Sector
    • Solar panel glass
    • Specialized glass for energy-efficient windows
  8. Aerospace and Defense
    • High-precision optical components
    • Specialized glass for cockpit displays
  9. Medical and Scientific Research
    • Laboratory equipment glass
    • Optical lenses for medical devices
    • Microfluidic chips

This advanced laser cutting system offers a versatile solution for a wide range of industries, providing high-precision, efficient, and eco-friendly processing of various glass and optical materials. Its ability to handle complex shapes and delicate materials makes it an ideal choice for both large-scale manufacturing and specialized, high-value applications.

 

Technical Parameters:

Technical Parameters: Advanced Laser Cutting Systems

Parameter Dual-platform Ultrashort Pulse Laser Cutting Machine Dual-platform Picosecond Laser Cutting Machine Single-platform Picosecond Laser Cutting Machine
Model Number HT-1PG-6070GD/6090GD HT-1PG-4050D/6070D/6090D HT-1PG-4050/6070/6090

Laser Specifications

  • Laser Type: Ultrashort pulse fiber laser (specific type varies by model)
  • Average Power: 50W (options for 10W, 20W, 30W, 60W, 80W available)
  • Wavelength: 1064nm, with second harmonic at 532nm
  • Pulse Width: <10ps (picoseconds)
  • Repetition Rate: 1Hz - 1000kHz (adjustable)
  • Beam Quality: M² < 1.2 (near-diffraction-limited beam)

Cutting Performance

  • Positioning Accuracy: ±2μm over entire work area
  • Repeatability: ±1.5μm, with ±16 arc-seconds angular accuracy
  • Maximum Cutting Speed: Up to 1000mm/s
  • Cutting Thickness:
    • Ultra-thin glass: ≤1mm
    • Standard glass: ≤19mm (varies based on material properties and cutting requirements)
  • Minimum Line Width: ≤30μm (material dependent)
  • Minimum Hole Diameter: ≤20μm

Work Area Dimensions

  • Dual-platform Models: 600x700mm, 600x900mm, or 400x500mm per platform
  • Single-platform Model: 400x500mm, 600x700mm, or 600x900mm

Power and Electrical

  • Power Consumption: 150W (250W/350W standby)
  • Input Voltage: AC220V ± 10%
  • Frequency: 50-60Hz

Physical Specifications

  • Machine Dimensions:
    • Length: 1600mm - 2550mm (model dependent)
    • Width: 1700mm - 2080mm
    • Height: 1960mm
  • Weight: 3500kg - 5000kg (varies by model)

Additional Features

  • Cooling System: Built-in water cooling for thermal stability
  • Control System: Advanced CNC with high-speed processing capabilities
  • Software: Proprietary cutting optimization software included
  • Safety Features: Class 1 laser safety enclosure, emergency stop buttons

Environmental Requirements

  • Operating Temperature: 18-28°C (64-82°F)
  • Humidity: 40-70% non-condensing
  • Power Stability: ±5% maximum fluctuation

Optional Upgrades

  • Enhanced vision system for automatic alignment
  • Automated material loading/unloading system
  • Custom fixture designs for specific applications
  • Extended warranty and service packages available

Note: Specifications may vary slightly based on specific configurations and continuous product improvements. Please consult with our technical team for the most up-to-date information and customization options.

 

Applications:

Scope of Application: Versatile Laser Cutting Solutions

Our cutting-edge laser cutting machine is developed to meet a diverse range of industrial needs, delivering precision and efficiency across various materials and applications:

1. Instrument Panel Manufacturing
  • Ideal for producing high-precision instrument panels, dashboards, and control interfaces
  • Capable of handling thin to medium-thickness materials with exceptional accuracy
2. Specialized Glass Processing
  • Ultra-thin Glass: Accurate cutting of delicate glass sheets for electronic devices
  • White Glass: Clean and precise processing for decorative and architectural applications
  • High-Borosilicate Glass: Specialized cutting for laboratory equipment and heat-resistant products
  • Quartz Glass: Precision cutting for optical components and semiconductor industry needs
3. Electronic Component Fabrication
  • Tailored for cutting PCB boards, flexible circuits, and other electronic substrates
  • Ensures clean edges and minimal thermal impact on sensitive electronic materials
4. Gemstone and Precious Material Processing
  • Sapphire Cutting: Used for watch faces, smartphone camera lenses, and high-end displays
  • Precision Gemstone Shaping: Managing intricate designs in precious and semi-precious stones
  • LED Component Manufacturing: Cutting sapphire wafers for LED production
5. Liquid Crystal Display (LCD) Panel Fabrication
  • Capable of processing various LCD components, including:
    • ITO (Indium Tin Oxide) conductive films
    • RGB color filters
    • Polarizing films
  • Ensures accurate cutting without destroying delicate display materials
6. Specialized Optical Film Processing
  • Accurate cutting of K9 optical glass for high-quality lenses and prisms
  • Precision shaping of optical films for a variety of industrial and scientific applications
Additional Capabilities:
  • Micro-cutting of small, intricate parts for the medical and aerospace businesses
  • Custom shape cutting for unique product designs and prototypes
  • Multi-layer material processing for composite products

Our laser cutting system's versatility makes it an indispensable tool throughout many industries, from consumer electronics to advanced scientific research, ensuring high-quality results and efficient production processes.