Reduce costs by 30%! Laser glue remover empowers semiconductor packaging, creating an efficient engine for SOT252 mass production
July 20, 2026
Are you still struggling with the high repair rate caused by SOT252 overflow in semiconductor packaging, automotive electronics, or industrial power supplies?
Every additional manual cleaning process is eroding your profit margin The laser glue remover is designed for batch glue removal of power devices, truly achieving cost reduction and efficiency improvement.
Three core advantages
Precision assurance: visual guidance+precise optical path, non-destructive debonding, with a yield rate of up to 99.5%;
Efficiency doubled: automatic loading and unloading, single processing<5 seconds, daily production increased by 2.5 times;
Green and energy-saving: no chemical waste, no tool loss, and a 30% reduction in comprehensive operation and maintenance costs.
It uses high-energy beams to instantly vaporize excess epoxy resin, achieving non-contact and precise removal. The device is equipped with an intelligent visual positioning system that can automatically recognize the irregular pin contours of SOT252, effectively removing residual glue at the root of the pins and the heat dissipation pad area. The removal accuracy is stably controlled within ± 0.05mm, and the metal substrate is completely undamaged.
Choosing laser debonding means choosing a stable, efficient, and low-cost mass production mode in the fields of semiconductor packaging, automotive electronics, and industrial control power supplies,
Replace manual labor with equipment to accurately handle the overflow details of each SOT252 power device, helping your production line pass rate steadily increase.
