What are the advantages of laser processing ceramic substrates compared with different light sources?

With the continuous development of 5G construction, precision microelectronics, aviation, aerospace, and other industrial fields, ceramic substrates have become a crucial material for large-scale production of electronic structures and interconnected technologies. Laser processing equipment mainly used for cutting and drilling ceramic PCBs has been widely used in precision manufacturing.

Ceramic materials are high-quality thermal insulation materials with high-temperature stability, chemical corrosion resistance, and excellent thermal conductivity, making them suitable for large-scale production of multilayer PCBs and high-frequency circuits. Laser processing ceramic PCBs plays an important role in the electronics industry.

Advantages of laser processing ceramic substrate PCBs

1. Laser beams have high energy density, good processing quality, and fast cutting speed;
2. Material saving and high efficiency;
3. Precision machining with smooth cutting edges;
4. Minimal thermal impact area.

Ceramic substrates are easily brittle and require higher technical requirements for processing than glass substrates, so laser drilling is generally used.

Differences between various light sources (ultraviolet, green, red) for cutting ceramic substrates

• Red light: The red light source is commonly used for cutting ceramic substrates. With a wavelength of 1064nm, it has a longer wavelength compared to green light at 532nm and ultraviolet at 355nm, and therefore, a larger thermal impact area.
• Green light: Green light sources require higher precision, with a moderate thermal impact area.
• Ultraviolet light: Ultraviolet lasers are suitable for processing materials that require cold working, with the smallest thermal impact area. They are generally used for cutting non-metallic PCB substrates, leaving minimal thermal impact and reduced carbonization.